
To create embossed microstructures in PMMA, the silicon stamp must be carefully patterned and manufactured. (Image courtesy of Hayden Taylor. Used with permission.)
Instructor(s)
Prof. David Hardt
Prof. Duane Boning
MIT Course Number
2.830J / 6.780J / ESD.63J
As Taught In
Spring 2008
Level
Graduate
Course Description
Course Features
- Video lectures
- Demonstration - video
- Lecture notes
- Assignments: problem sets with solutions
- Assignments: written with examples
- Exams and solutions
Course Description
This course explores statistical modeling and control in manufacturing processes. Topics include the use of experimental design and response surface modeling to understand manufacturing process physics, as well as defect and parametric yield modeling and optimization. Various forms of process control, including statistical process control, run by run and adaptive control, and real-time feedback control, are covered. Application contexts include semiconductor manufacturing, conventional metal and polymer processing, and emerging micro-nano manufacturing processes.
Other Versions
Other OCW Versions
OCW has published multiple versions of this subject.